Automated Wafer Thickness and Flatness Measurement System

The MicroSense UltraMap UMS-300-BP is a semi- automated Wafer Measurement System which measures the thickness and TTV of wafers and substrates of any material, resistivity, thickness and surface condition with excellent repeatability. Wafers, up to 300 mm, are manually loaded into the measurement system; all wafer positioning and non-contact wafer measurements are fully automatic. The system handles either wafers only, or is configurable for handling wafers on tape in frame.

Applications

Measure Thickness of Thinned Wafers after backgrind – a vacuum wafer holder is used for measuring thickness of thinned wafers down to 100 microns, or thinned wafers on tape down to 50 microns.

Measure Thickness and TTV of Wafers On Tape – flexible software algorithm provides a method for determining wafer thickness and TTV even when wafer is mounted to tape or die attach film.

MicroSense UltraMap - A Better Approach to Wafer Measurement

Wide thickness measurement range – 50 μm to 3mm wafer thickness

Production friendly design – no cleanroom required - measure wafers at all steps during wafer making process

Integrated standards for in system auto-calibration

Air Bearing X-Y Wafer Stage for reliable, repeatable measurements

Measurement Technology

The UMS-300-BP uses two patented backpressure sensing probes for precise measurement of all materials conductive or non-conductive. The advantages of this sensing probe technology include:

Integrated, in system auto-calibration of backpressure sensors - no need for master wafers, no lost productivity for calibration

No need to adjust for different materials

Automatic adjustment to material thickness